Founded in 2010, Skychem has been dedicated to functional wet electronic chemicals for electronic circuit, semiconductor packaging, display, and new energy industries.
Skychem went public on the SsE STAR Market in 2023 with stock code 688603, embarking on a historic newjourney of development.
Skychem focus on technological innovation in chemical deposition, electrochemical deposition, and interfaciatreatment. With over three decades of experience, our R&D team has deep expertise in these industries, making usone of the most professional and leading companies in both domestic and international markets, in the realm olelectronic circuits, the company is on par with international competitors, and its products and technical serviceshave garnered widespread acclaim within the sector. Particularly in the metallization technology on surfaces ofpolyimide, PET, and ABF materials, the company’s products are noted for their stable performance and have earnedthe recognition of mainstream IC substrate manufacturers and top-tier OEMs.
In the field of semiconductor packaging, including redistribution layers (RDL), bumpings, and through-silicon viaITSV) electroplating, Skychem has also received affirmation from renowned packaging factories, With the development of high-performance computing (HPc) and artificial intelligence (Al), the company has rapidly invested inthrough-glass via (TGv) metallization technology, which has been widely recognized by the industry players. At thesame time, in-depth cooperative relationships have been established with top-tier OEMs, to contribute together tothe scalling up of this technologies in various applications.
Skychem will continue to leverage its robust R&D capabilities, continuous innovation, and global strategies toprovide customers with high-performance functional wet electronic chemicals and quality services, We are a reliablepartner you can trust!