Japan Pure Chemical Co.,Ltd.
Booth No.: E 36
Company Profile
Our main business is the development, manufacture, and sales of precious metal plating chemicals used for the contact and connection points of electronic components such as printed circuit boards (including IC substrates), connectors, and lead frames. In particular, we provide comprehensive proposals and services, including process advice and after-sales support. We strive to offer products well-suited to user needs, supported by comprehensive proposals, process advice, and after-sales services.
Since our establishment in July 1971, we have always focused on the electronics industry as our primary target, and have introduced gold, silver, and palladium plating chemicals for semiconductor packages and connectors to the market in line with the growth of the electronics industry. Especially in product development, we have built a proprietary technology system and accumulated expertise over many years.
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Products
Electroless Gold Plating Chemicals (Immersion gold/Reduction gold/Hybrid gold)
Our electroless gold plating series provides a pure Au plating deposition layer with excellent adhesion on Ni (Electroless Nickel Immersion Gold), Pd (E’less Ni E’less Palladium Immersion Gold), and Cu (Direct Immersion Gold). The deposited Au shows excellent corrosion resistance, wire bondability, and solder joint reliability.
Electroless Palladium Plating Chemicals
NEO PALLABRIGHT Series is reduction Pd plating solution, that is suitable for ENEPIG & EPIG (Electroless Pd Immersion Gold) processes. We offer both pure Pd and Pd-P types. The deposited Pd provides excellent wire bondability and solder joint reliability.
Electrolytic Gold Plating Chemicals
Our electrolytic gold plating includes TEMPERESIST (soft gold) and OROBRIGHT Series (hard gold). TEMPERESIST gives 99.99 wt.% purity Au deposition suitable for PCB, PKG and semiconductors especially for wire bonding applications. OROBRIGHT provides 160-210 HV Au suitable for PCB, connectors and contacts with lower contact resistance and excellent solder wettability.