CO2 dual table four-beam model（CO2双台面四光束机型）

 High-precision alignment, multi-target alignment
 Ultra-high-performance models that focus on the pursuit of high speed and high accuracy
 Resin substrate processing is compatible with the model
 High-precision machining and positioning
 Superior productivity
高精度对位、多靶位对位
专注于追求高速高精度的超高性能机型
树脂基板加工对应机型
高精度加工定位
超群的生产效率

Direct imaging system（直接成像系统）

 Control 3 wavelengths with ease
 "Ledia HPLED" equipped with a high-power light source
 UV-LED multi-wavelength exposure
 Suitable to all kind of solder mask ink to achieve high-quality exposure
 "High speed" and "high precision" high-speed alignment
 Models can be selected from high-volume production to prototype and low-volume production
产品系列中，最佳的精度和稳定性
大幅度提升成像位置精度
温度控制，结构上增加了冷却单元以优化设备内部的温度管理
主机机台焕然一新，更优化了曝光镜头和校准单元
持续性校准，保持高生产效率同时，实现持续性高精度校准

Fully Automated Lamination Machine (Packaging Substrate) （自动贴膜机）

 Compatible with various board thickness,
 includes ultra-thin panels.
 Options for inner and outer layer lamination
 process for HDI PCB applications.
 High productivity with low in machine down-time.
 Uniform lamination pressure distribution.
 Precise lamination for copper retention .
 Easy exchange of lamination roller.
贴膜机热压辘容易更换
容易保养，贴膜压力良好均匀
运作时，热压辘温度的下降度减慢
提高贴膜的对位精确度
映射极厚板（Mach 630NP-UT）