Recently, during the Thai Samsung Electronics Sourcing Day organized by the Board of Investment (BOI) in collaboration with Thai Samsung Electronics Co., Ltd., the Thailand Printed Circuit Association (THPCA) participated as an industry partner and expressed strong support for the initiative to increase local content utilization and integrate Thai manufacturers into the global supply chain.

Thai Samsung announced its target to raise local sourcing to over 70% for its Thailand production base. This direction reinforces supply chain resilience, reduces external risks, and strengthens long-term competitiveness of Thai suppliers.

THPCA recognizes that this strategy aligns closely with Thailand’s PCB and electronics industry roadmap, particularly as the country advances into high-value segments such as AI servers, electric vehicles, smart appliances, and intelligent systems. A strong domestic PCB foundation is essential to support these global technology demands.

With more than 200 participating companies and 54 successful business linkages during the event, the momentum clearly demonstrates the readiness of Thai manufacturers to integrate into global production networks when provided with the right platform.

Building upon this momentum, THPCA will carry forward the concept of “Strengthening Local Supply Chain for Global Integration” to Thailand Electronics Circuit Asia 2026 (THECA 2026). The event will serve as a comprehensive ecosystem platform connecting PCB manufacturers, PCBA producers, EMS providers, material suppliers, and global technology brands.

THECA 2026 aims to become more than an exhibition. It will be a strategic gateway for investment, innovation collaboration, and supply chain integration in ASEAN’s electronics landscape.

THPCA invites local and international stakeholders to join THECA 2026 and be part of Thailand’s journey toward a stronger and globally integrated electronics supply chain.

🗓 THECA 2026 + Power2Motion | 26–28 August 2026 | BITEC Bangkok
📍 Innovating PCB and Advanced Electronics with Next-Gen Packaging

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