QDOS TECHNOLOGY SDN BHD
Booth No.: L33
Company Profile
QDOS is a Malaysian company having 33+ years’ experience in manufacturing high Technology Flexible PCBs & IC Substrates, having multi-site manufacturing (MY + China) with integrated R&D + production. QDOS supports complex customer designs globally in telecommunications, automotive, industrial, medical, and semiconductor sectors. We have scalable infrastructure for driving future growth aligned with customer needs
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Products
- Flexible PCB Product Range
QDOS offers single-layer (bare back), double-sided, multilayer (11L Air Gap), rigid-flex (12L), ultra long flex (>2 mtr/ 2L) and flex assemblies for diverse industries like telecom and automotive
- Tape and Ceramic Substrates
Tape substrates like COF and TAB are produced via roll-to-roll processing having ultra fine lines (15/15 um) using mSAP circuit formation, wet chemical etching of PI on sputtered FCCL; ceramic substrates (DBC & AMB) serve high-power applications in EV inverter applications
- IC Substrate Solutions
Coreless and core-based IC substrates such as MIS (3.5L with SMT stud) for PMIC (GaN), Panel Level Packaging for SiC, FCBGA (ABF BU upto 16L ALIC) , and thin-core BT substrates (4L) support high-I/O semiconductor packages. Electroformed Mushroom substrate provide extremely thin packaging using 2mil thickness.