AXB-662 is a copper chloride-based micro-etching solution that.

creates a uniformly roughened surface on copper and copper alloy,

substrates. It is suitable for dry film, solder mask, and via filling

processes in BGA or FLIP applications. Additionally, it can be used as

a pre-treatment for chemical tin and electroless nickel-gold (wet film

and solder mask) in FPC and PCB

Environmentally friendly stripping agent AXE-098 is a safe

smokeless and environmentally friendly stripping agent, which

basically does not contain ammonia nitrogen, can be quickly

peeled off clean and does not hurt the substrate, can be used

for the removal of copper metal plating of stainless steel

above 314 materials, can completely replace nitric acid,

suitable for VCP, copper wire, etc.

AXB-736 series products are developed for dry film and solder mask

development, using high-purity impurity-free organic alkali potassium

carbonate, and adding special additives, which can speed up the

development speed, prevent the formation of hard water scale, and

extend the life of the bath liquid by 3-5 times of sodium carbonate,

effectively reducing the amount of wastewater.