dry-film photosensitive :

The dry film photoresist is a key material for image transfer in the PCB and FPC industries, directly determining the quality of the image transfer.

Photoimageable coverlay

The FC series low-modulus photoimageable coverlay film is specially developed for high-resolution flexible printed circuit board (FPC) used in smartphones and similar devices. It is a photoimageable protective film that features high resolution, low warpage, and excellent flexibility.

Flexible FCCL

Flexible Copper Clad Laminate (FCCL) is an essential base material for FPCs. Compared to rigid Copper Clad Laminate (CCL), FCCL offers the advantages of being lighter, thinner, shorter, and smaller. It also provides excellent dimensional stability, flexibility, thermal stability and long-term reliability.