Booth No.: M26
Focuz provides advanced EMS & ODM manufacturing services with extensive experiences in Chip on Board (COB), Hybrid Electronic Packaging, Packaging of Optoelectronic and Precision Electro-Mechanical Modules/Sub-Assemblies for OEMs in
Optical Telecom & Datacommunication
Advanced Consumer Products
Biomedical & Healthcare
Industrial Applications
Clean Energy
COB & Optoelectronic Packaging
Wafer Dicing, Precision Die Attachment, Wire Bonding, Optical Alignment & Attachment, Hermetic Sealing, Leak Test, Burn-In, Functional Test

PCBA & Box Build
SMT, Wave Soldering, Conformal Coating, Potting, ICT, FCT, X-Ray, Box Build Assembly, Cable Assembly

High-Precision Opto-ElectroMechanical Assembly
High-Precision Assembly, Optical Alignment & Attachment, Optical Fiber Splicing & Handling, Laser Welding, Burn-In, Functional Test
