Booth No.: H21
HoneySpring Company was established in Shenzhen in 2006 and is an authorized distributor of DuPont. Its main products include DuPont Kapton® polyimide films, DuPont Riston® dry film series, DuPont Pyralux® flexible circuit materials, as well as various DuPont chemical solutions. These products are widely used in industries such as printed circuit boards (PCB), electrical insulation, high-speed rail, telecommunications, new energy, and automotive.
HoneySpring is committed to providing industry customers with high-quality products, reliable services, and innovative technical solutions. With increasing market demand and business expansion, the company has established offices in Shenzhen, Shanghai, Suzhou, Chengdu, Hong Kong, and Thailand. Its business now covers all of China and Southeast Asia, and it has built strong partnerships with many leading enterprises in the industry. Its products and services have been widely recognized and highly praised by customers.
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QNITY™ Copper Gleam™ PPR-III pulse acid plating copper
New generation pulse electroplating for advanced MLB
Copper Gleam™ PPR-III pulse acid plating copper is designed for excellent throwing power on through-hole to fulfill future fine line trend and reliability requirement.
Advantages:
Outstanding throwing power and through-hole uniformity for AR 16~40 through-holes.
Fine-grained and equiaxial structure .
High mechanical and thermal reliability.
DuPont™ Riston® DI9500M & DI8600 dry film photoresist
The advanced dry film photoresist for fine line HDI
Riston® DI9000 & DI8600 series are multi-wavelength DI dry film photoresist designed for pitch >= 70µm tent/etch process. It enables fine patterning with excellent yield.
Riston® dry film photoresist roadmap (HDI application)
Advantages (*DI95M)
Fine line resolution and adhesion (15μm/15μm)
Excellent dimension stability to reach better line width Cpk
Excellent conformation for applying thin film to reach better yield and etching factor
Low developing sludge and foaming for easy maintenance
Applications
The advanced dry film solution for HDI (inner layer to outer layer) tent/etch process
