MacDermid Alpha Electronics Solutions
Booth No.: D 41
Company Profile
MacDermid Alpha Electronics Solutions, a prominent business of Element Solutions Inc, holds a distinguished position as a global leader in the field of fully integrated materials, helping to deliver enhanced performance, reliability, and sustainability to electronic manufacturers worldwide.
Their expertise is segmented as follows:
• Wafer Level Solutions: Revolutionizing wafer fabrication processes for enhanced efficiency and performance.
• Semiconductor Assembly Solutions: Driving innovation in semiconductor assembly processes for unparalleled reliability.
• Circuitry Solutions: Tailored solutions to meet the dynamic demands of modern circuitry.
• Circuit Board Assembly Solutions: Elevating circuit board assembly processes for optimal performance.
• Film & Smart Surface Solutions: Transforming electronics with cutting-edge materials and technologies for enhanced functionality and reliability.
With a legacy spanning over a century of innovation, MacDermid Alpha has garnered the trust of manufacturers around the globe and is actively shaping industries such as automotive, consumer electronics, mobile devices, telecom, data storage, and infrastructure. The business is uniquely positioned to deliver high-quality solutions and technical services to comprehensively cover the entire electronics supply chain.
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Products
Shadow® Plus
Shadow® Plus is a graphite-based, patented wet-etch direct metallization technology that provides enhanced reliability for high-density applications. It enables the plating of microvias and through holes using graphite-based colloids and proprietary additives to make the holes conductive. The technology is our most advanced alternative to electroless copper, delivering faster throughput and significant sustainability benefits.
Caption: Cross section of a through hole covered with Shadow Plus showing clean copper inner layers and ready for electroplating.
MacuSpec™ VF-TH 500
MacuSpec™ VF-TH 500 acid copper metallization process is designed for high-density interconnect (HDI) boards that require simultaneous via filling and through hole plating with excellent microdistribution. This versatile solution enables fabricators to meet stringent reliability and performance requirements for complex, multilayer boards used in next-generation technologies.
Caption: MacuSpec VF-TH 500 is designed to fill large microvias to a flat surface.
Affinity™ ENIG/ENEPIG
The Affinity™ portfolio of ENIG (Electroless Nickel / Immersion Gold) and ENEPIG (Electroless Nickel / Electroless Palladium / Immersion Gold) surface finishes stands out for delivering best-in-class thickness uniformity and eliminating corrosion.
These systems offer exceptional durability and solderability, making them ideal for mission-critical applications that demand long-term reliability.
Caption: Corrosion observations are reduced to zero with the Affinity ENIG/ENEPIG surface finishes, eliminating reliability concerns associated with traditional systems.
