Mitsui Copper Foil (Malaysia) Sdn. Bhd.
Booth No.: L 42
Company Profile
Mitsui Copper Foil (Malaysia) Sdn. Bhd. stands at the forefront of copper foil innovation, powering the
next generation of electronics, mobility, and smart technology.
As a core subsidiary of Mitsui Mining & Smelting Co., Ltd., Japan, we bring more than a century of
metallurgical excellence and breakthrough R&D to the heart of South East Asia’s electronics
ecosystem.
Strategically based in Malaysia, our facility is a critical hub for high-performance copper foil —
engineered for advanced PCB & CCL applications. We serve a diversified customer base ranging from
consumer electronics to automotive and telecommunications giants.
Driven by Japanese precision, global quality standards, and local agility, Mitsui Copper Foil delivers
materials that meet the most demanding technical, environmental, and reliability requirements.
We don’t just supply copper foil—we enable progress, accelerate innovation, and strengthen our
customers’ competitive edge.
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Products
MicroThin™
MicroThin™ is Mitsui Copper Foil’s precision-engineered, ultra-thin copper foil, designed specifically
for advanced IC packaging and modified semi-additive process (mSAP) applications. With thicknesses
as low as 1μm, MicroThin™ provides the ideal foundation for high-performance semiconductor
packaging, enabling high-density interconnects (HDI) in cutting-edge devices.
VSP
VSP by Mitsui Copper Foil is designed for high-performance applications requiring low loss, high signal
integrity, and superior thermal stability. Its ultra-smooth surface, excellent peel strength, and fine-line etching
minimize signal attenuation, making it ideal for 5G infrastructure, high-speed computing, and advanced
multilayer PCBs.
FaradFlex™
FaradFlex™ is Mitsui Copper Foil’s advanced Buried Capacitance solution. Engineered for ultra-low
transmission loss, tight impedance control, and FaradFlex™ is optimized for high-speed, high-frequency
applications including AI servers, 5G base stations, data centers, and HPC platforms. FaradFlex™ is widely
adopted.
