From AI-powered vehicles and EVs to autonomous systems, high-performance computing, and next-generation data centers, every breakthrough is powered by advanced electronics, PCB technologies, and semiconductor innovation. Advanced Packaging is rapidly emerging as one of the industry’s most critical enabling technologies, driving higher performance, greater integration, and unprecedented computing power.
That is why Power2Motion is more than just a mobility showcase. It is where Electronics × Mobility × AI converge, bringing together the entire ecosystem, from PCB and PCBA to Semiconductors, Advanced Packaging, AI, EV, Automation, and Data Center technologies under one roof.
At Power2Motion, you will:
✅ Discover breakthrough technologies from leading global innovators
✅ Explore the latest trends in AI, EV, Advanced Packaging, and Quantum Computing
✅ Gain insights from 50+ conference sessions led by international industry experts
✅ Connect with engineers, business leaders, investors, and technology professionals from around the world
Whether you are an engineer, manufacturer, technology leader, investor, researcher, or business decision-maker, this is your opportunity to experience the technologies shaping the future of global industry.
🎟️ Register Today for Free!
Enjoy complimentary admission (regular on-site admission fee: THB 500).
On-site registration fee: THB 500
👉 Register Now:
https://thecaregistrations.com/Registration/ChooseTypeRegis.aspx?codeInv=THECA2
🗓 THECA 2026 + Power2Motion | 26-28 August 2026 | EH 98-99 BITEC Bangkok
📍 Innovating PCB and Advanced Electronics with Next-Gen Packaging
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