Industrie De Nora S.p.A.
Booth No.: G 36
Company Profile
De Nora was founded in 1923 by Oronzio De Nora. Our Company is committed to developing unconventional solutions to achieve the energy transition towards decarbonization, enable the hydrogen economy and ensure clean water for everyone.
De Nora is a leading manufacturer of high-performing electrodes used in electrochemical applications worldwide. Specially, our electrodes are widely used for Copper foil manufacturing, PCB plating and semiconductor plating processes. Our robust and proven electrochemical solutions are under a continual development process to simplify and make their utilization safer. Thanks to our proprietary DSA® electrodes, we can optimize operations in a broad range of applications, making our electrochemical systems more effortless than ever.
De Nora has 24 operating companies in 10 countries and 5 R&D centers. With its widespread presence and broad product portfolio, the Company can effectively serve customers in 100 countries, employing more than 2,000 people worldwide.
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Products
DSA® anode for Copper Foil Electrodeposition
DSA® anode for copper foil manufacturing is barely worn during use, while the electrode gap remains constant. Accordingly, copper foils can be produced with a uniform current distribution. In addition, DSA® anode has a lower anode potential than a lead electrode and thus can contribute to reduced power costs.
DT plating anode
De Nora DT plating anodes have become the primary choice in copper-via-filling and mSAP electrodeposition processes for manufacturing both HDI printed circuit boards and semiconductor substrates. DT anodes are the solution in the electronics industry due to: uniform copper deposition, reliable via filling ability, and minimum additive consumption.
De Nora platinum anode
De Nora platinum anodes have a proprietary deposited platinum layer which provides a smooth, non-porous surface, superior wear resistance for long anode life at high current densities. It has been widely used of precious metal electroplating plating for PCB and semiconductor manufacturing processes.
