IC packaging substrate vertical coating machine: This equipment is specifically designed for the coating process of IC packaging substrates. It adopts a two-stage vertical coating method combined with a suspended tunnel furnace, capable of producing substrates as thin as 0.06mm. It features stable production capacity and reliable quality.

Horizontal coating automatic production line: This product adopts a horizontal coating and pre-baking tunnel oven method, which can meet 80% of the product thickness requirements in the PCB industry. It uses side-supported and suspended tunnel ovens and can also replace the traditional three-machine combined printing production line, solving customers' problems with thick and thin boards and reducing the use and reliance on screen printing workers.

Automatic lifting oven: The fully automatic oven door lifting type oven, when paired with an AGV vehicle, achieves fully automatic door opening, material discharge and discharging. The product takes up a small area and is very suitable for working environments with high requirements for site utilization efficiency.