Indubond Technologies
Booth No.: L 33
Company Profile
InduBond Technologies is a cutting-edge innovator in PCB lamination, pioneering the use of induction heating to deliver unmatched thermal uniformity, energy efficiency, and process automation. Our flagship X Press line sets a new standard in multilayer lamination, offering fast, precise heating with significantly reduced energy consumption. Recognized with industry awards and installed in leading fabrication facilities worldwide, InduBond systems support manufacturers aiming for tighter registration, faster cycles, and greener production. Backed by a growing network of international distribution partners, InduBond is the ideal solution for those seeking the next generation of PCB lamination technology.
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Products
InduBond X‑Press 360
The InduBond X-Press uses induction heating to deliver precise, uniform energy across X, Y, and Z axes for fast resin curing without thermal delays. Cold cycles run in the same chamber with controlled airflow and water temperature. It features up to 75 kg/cm² pressure, high vacuum sealing, 450 °C capability, and a compact, modular design.
InduBond RFX Bonding Machine
It’s a precision pin-registration system featuring four independent heads capable of bonding at any point within a PCB—edges, interior, or flex areas—based on Gerber file coordinates. The bonding heads transfer thermal energy through localized bonding spots (“virtual pins”) that clamp layers flat, improving planarity, reducing warpage, and enabling tighter tolerances (<10 μm). This process enhances yield and registration accuracy ahead of pressing, offering significant advantages for complex multilayer, rigid-flex, and flex PCB fabrication.
