Mitsui Copper Foil (Malaysia) Sdn. Bhd.

Booth No.: L 42

Company Profile

Mitsui Copper Foil (Malaysia) Sdn. Bhd. stands at the forefront of copper foil innovation, powering the next generation of electronics, mobility, and smart technology.
As a core subsidiary of Mitsui Mining & Smelting Co., Ltd., Japan, we bring more than a century of metallurgical excellence and breakthrough R&D to the heart of Southeast Asia’s electronics ecosystem.
Strategically based in Malaysia, our facility is a critical hub for high-performance copper foil —engineered for advanced PCB & CCL applications. We serve a diversified customer base ranging from consumer electronics to automotive and telecommunications giants.
Driven by Japanese precision, global quality standards, and local agility, Mitsui Copper Foil delivers materials that meet the most demanding technical, environmental, and reliability requirements.
We don’t just supply copper foil—we enable progress, accelerate innovation, and strengthen our
customers’ competitive edge.

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Products

VSP by Mitsui Copper Foil is designed for high-performance applications requiring low loss, high signal
integrity, and superior thermal stability. Its ultra-smooth surface, excellent peel strength, and fine-line etching
minimize signal attenuation, making it ideal for 5G infrastructure, high-speed computing, and advanced
multilayer PCBs.

FaradFlex™ is Mitsui Copper Foil’s advanced Buried Capacitance solution. Engineered for ultra-low
transmission loss, tight impedance control, and FaradFlex® is optimized for high-speed, high-frequency
applications including AI servers, 5G base stations, data centers, and HPC platforms. FaradFlex® is widely
adopted