Polar Instruments (Asia Pacific) Pte Ltd.
Booth No.: N 31
Company Profile
Polar Asia Pacific was established in 1999, as a wholly subsidiary of Polar Instruments Ltd, UK to provide sales, marketing and after-sales support to customers and prospects in the Asia Pacific region.
Polar Asia Pacific is now run as an independent company and has under its umbrella franchises for some world’s leading product and service providers for PCB design, testing, repair and quality control solutions. Headquartered in Singapore with direct offices in China, India, Tiwan and though our exclusive channel partner in rest of Asia Pacific. Polar Asia Pacific deals in hardware and software solutions for PCB Design, Testing, Repair and PCB manufacturing industry.
Polar Asia Pacific provides repair, calibration, on-site annual maintenance contract from our own certified service centers located in Singapore, Shanghai (East China), Zhuhai (South China), Bangalore (India), Taipei (Taiwan) and our authorized service centers located at our channel partners in Seoul (Korea), Tokyo (Japan) & Bangkok (Thailand).
SPEEDSTACK PCB / CITS880s – Stackup Design / Impedance Loss measurement made easy
Designed for OEM / PCB / CEM for accurate stackup design & Impedance measurements
Accurate documentation of Impedance / Lossy stackup design for rigid & flex stacks
Designed for PCB production environments
Measures traces on test coupons or actual PCBs
Supports Groundless differential testing
Multi point traceable calibration
Polarcare ongoing latest updates and support
Website: click
Products
SPEEDSTACK PCB / CITS880s- IMPEDANCE DESIGN / TEST SYSTEM
Speedstack PCB allows PCB designers to design accurate and efficient rigid and flex-rigid multilayered PCB stackups, with error-free documentation for tighter impedance control. Si8000m field solver works in background to calculate single / differential impedance traces accordingly to specification. CITS880s tests actual manufactured impedance traces on either coupons or boards.
FALCON - PINLESS OPTICAL LAYER REGISTRATION AND WELDING SYSTEM
Falcon series uses four independently controlled GigE camera modules to perform quadrilateral deformation measurements of each PCB inner layer. The Lay-Up system uses measurement results as a benchmark to adjust each inner layer to the best center to achieve an ultra-high-precision layer to layer alignment with stacks thermally welded.
IST HC / DELAM – INTERCONNECT STRESS & DELAMINATION TESTERS
Interconnect Stress Test (IST) provides accelerated stress test for quality testing of different via technologies and interconnect structures for quality testing of high-end PCBs used in aerospace, automative, defense, computing and medical applications. DELAM tests for delamination of high technology and layer count multilayer HDI builds used in modern PCBs.