QDOS Technology Sdn Bhd
Booth No.: C 36
Company Profile
We are a leading Malaysian-owned manufacturer of high-end flexible PCBs and IC substrates, delivering cutting-edge solutions for data processing and transmission across global industries.
With over 30 years of expertise, we continuously invest in next-generation technologies across our three advanced factories, ensuring innovation, reliability, and scalability for our partners. We implement advanced interconnect technologies in powering the future of electric vehicles, automative electronics and battery systems, offering one-stop solution for EV applications i.e super long DS PTH FPC Assembly (>2 mtr) for CCS applications.
Trusted by global technology leaders, Qdos provides customized design and fabrication services with a flexible, agile business model—supporting everything from low to high volume and complex mix requirements.
Driven by a future-forward vision and strong social commitment, Qdos is your trusted partner in advancing the next wave of interconnect technology.
Let’s innovate together
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Products
~2 mtr long 2L PTH FPC for EV CCS with assembly of Ni tabs, NTC, foam etc. for medical catherer application 
Adhesiveless 4L FPC with thick Cu (70um), laser welding (battery-pack application) 
11L split Flex (air gap) with impedance reqmts, used as connector in semicon test equipment 
COF 2ML Detector Flex-CT Scan Via in pad , Cu filled vias 25um to enable Miniaturization and support multichip assembly by flip chip ( Cu pillar) in medical display applications
COF 1ML Medical Flex-Digital X-Ray Tightest pitch of 35um to enable Au – Au TCB flip chip assembly for medical display application
3.5L MIS ABF IC SUBSTRATE Coreless substrates with any shape built up vias for wire bonding application, Gallium nitride Power management integrated circuits providing highest thermal management.
COF-TAB FLEX For MEMs die assembly using flying leads and dual access technology . For industrial applications , delivered in gapless reel format for automated die assembly.
